What feasibility tests will be conducted on the new DIP switch model?
Release Date:2023-02-07
New model DIP switch What feasibility tests will be conducted
1. Solderability test
The terminal top is immersed 1mm deep into the solder bath at a temperature of 230±5℃ for 3±0.5 seconds.
Note:
(1) Soldering time should be less than 3 seconds.
(2) Soldering area should be more than 80%.
2. Solder heat resistance test
For wave soldering, temperature is controlled at 260±5℃ with a pass time of 3±0.5 seconds on a 1.0mm thick substrate. For hand soldering, temperature should be controlled at 320±5℃ for 3±0.5 seconds.
Requirement: The body must not deform and must meet mechanical and electrical performance.
3. Life test
No load: The operator performs 100,000 no-load operations at a frequency of 60 times per minute.
Requirements:
(1) Contact resistance must not exceed 200mΩ.
(2) Others must meet mechanical and electrical functions.
4. Heat resistance test
After placing at 85±2℃ for 96 hours, then placing at normal room temperature for 1 hour for measurement.
Requirement: No abnormal appearance, meets mechanical and electrical functions.
5. Cold resistance test
After placing in an environment of 40±2℃ with relative humidity of 90~96% for 96 hours, then placing the sample at normal environment for 1 hour before inspection.
Requirement: No abnormal appearance, meets mechanical and electrical functions.
6. Humidity test
After placing in an environment of 40±2℃ with relative humidity of 90~96% for 96 hours, then placing the sample at normal environment for 1 hour before inspection.